Micron Breaks Ground on New $600 Million Plant in Xi’an China

Micron Technology, a leading memory chipmaker, began construction on its new packaging and testing facility in Xi'an, China in late March 2023. Scheduled for production in the second half of 2025, the plant will ramp up based on market needs. Upon completion, it will expand Micron's Xi'an presence to over 1.4 million square feet (132,000 square meters). 

In June 2023, Micron Technology announced a significant expansion of its Xi'an facility with a 4.3 billion yuan ($600 million) investment. This includes building new factories, introducing production lines for mobile DRAM, NAND, and SSD products, and broadening their overall product portfolio. The expansion strengthens Xi'an's position as Micron's global center of excellence for DRAM packaging and testing. 

At the media meeting, Ms. Wu Mingxia, General Manager of Micron China and Vice President of DRAM Packaging and Test Operations, said that local suppliers in China have played a key role in building the semiconductor ecosystem, and Micron is working hard to increase the number of local suppliers in the Xi'an factory.  

In addition, with the strong support of the governments of Shaanxi Province, Xi'an City and Xi'an High-tech Zone, Micron also announced that it has joined forces with Schneider Electric, a global digital transformation expert in the field of energy management and automation, to jointly develop a strategic partnership in sustainable development, smart manufacturing, green factories and Carry out strategic cooperation in areas such as dual carbon management.