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Taiwan Semiconductor BZV55C15 L1
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
RoHS
Y
Dimensions
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Diameter
1.6 mm
Length
3.7 mm
Physical
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Case/Package
MELF
Mount
Surface Mount
Number of Pins
2
Supply Chain
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Lifecycle Status
Production
Technical
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Element Configuration
Single
Impedance
30 Ω
Max Operating Temperature
175 °C
Max Power Dissipation
500 mW
Max Reverse Leakage Current
100 nA
Min Operating Temperature
-65 °C
Packaging
Tape and Reel
Power Dissipation
500 mW
Test Current
5 mA
Voltage Tolerance
5 %
Zener Voltage
IBS