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NXP Semiconductors MC9S12DG256MFUE
Product Details
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Compliance
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Halogen Free
Halogen Free
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Physical
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Case/Package
QFP
Mount
Surface Mount
Number of Pins
80
Weight
935.505914 mg
Technical
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Access Time
25 µs
Core Architecture
HCS12
Data Bus Width
16 b
Frequency
25 MHz
Interface
CAN, I2C, SCI, SPI
Max Frequency
25 MHz
Max Operating Temperature
125 °C
Max Supply Voltage
125 °C
Memory Size
256 kB
Memory Type
EEPROM, FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
16
Number of Bits
16
Number of I/Os
59
Number of Programmable I/O
91
Number of PWM Channels
8
Number of Timers/Counters
8
Oscillator Type
Internal
Peripherals
I2C, PWM, WDT
RAM Size
12 kB
Watchdog Timer
Yes