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NXP Semiconductors MC9S12A256MPVE
Product Details
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Compliance
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Halogen Free
Halogen Free
Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Physical
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Case/Package
LQFP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
112
Weight
1.278308 g
Technical
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Access Time
25 µs
Core Architecture
HCS12
Data Bus Width
16 b
Frequency
50 MHz
Interface
CAN, I2C, SCI, SPI
Max Frequency
50 MHz
Max Operating Temperature
125 °C
Max Supply Voltage
125 °C
Memory Size
256 kB
Memory Type
EEPROM, FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of I/Os
91
Number of Programmable I/O
91
Number of Timers/Counters
8
Operating Supply Voltage
5 V
Oscillator Type
Internal
Peripherals
PWM, WDT
RAM Size
12 kB