.png){kind=logo}
NXP Semiconductors LPC822M101JHI33Y
Product Details
Find similar products
Compliance
Select to search
related specs
related specs
RoHS
Compliant
Dimensions
Select to search
related specs
related specs
Height
850 µm
Physical
Select to search
related specs
related specs
Number of Pins
32
Technical
Select to search
related specs
related specs
Core Architecture
ARM
Data Bus Width
32 b
Frequency
30 MHz
Interface
850 µm
Max Frequency
30 MHz
Max Junction Temperature (Tj)
150 °C
Max Operating Temperature
150 °C
Max Power Dissipation
105 °C
Max Supply Voltage
3.6 V
Memory Size
16 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
12
Number of I/Os
29
Number of I2C Channels
4
Number of Programmable I/O
29
Number of PWM Channels
6
Number of SPI Channels
2
Number of Timers/Counters
3
Number of UART Channels
7
Operating Supply Voltage
3.3 V
Oscillator Type
Internal
Packaging
Tape & Reel (TR)
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
RAM Size
4 kB
Watchdog Timer
Yes