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NXP Semiconductors BGM1013,115
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Physical
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Case/Package
SOT-363
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
6
Weight
6.010099 mg
Technical
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Frequency
2.2 GHz
Gain
35.5 dB
Max Operating Temperature
85 °C
Max Power Dissipation
200 mW
Max Supply Voltage
5.5 V
Min Operating Temperature
-40 °C
Min Supply Voltage
4.5 V
Noise Figure
4.7 dB
Number of Channels
1
Operating Supply Current
27.5 mA
Operating Supply Voltage
5 V
P1dB
13 dBm
Packaging
Tape & Reel (TR)
Power Dissipation
200 mW
Test Frequency
1 GHz