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NXP Semiconductors BGA2802,115
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Physical
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Case/Package
TSSOP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
6
Technical
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Gain
31 dB
Max Frequency
2.2 GHz
Max Operating Temperature
125 °C
Max Power Dissipation
200 mW
Max Supply Voltage
3.6 V
Min Operating Temperature
-40 °C
Min Supply Voltage
3 V
Noise Figure
4.1 dB
Nominal Supply Current
12.5 mA
Number of Channels
1
Operating Supply Current
12.5 mA
Operating Supply Voltage
3.3 V
P1dB
7 dBm
Packaging
Tape & Reel (TR)
Power Dissipation
200 mW
Test Frequency
2.15 GHz