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NXP Semiconductors BF862,215
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
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Height
1.1 mm
Length
3 mm
Width
1.4 mm
Physical
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Case/Package
SOT-23
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
3
Weight
200.998119 mg
Technical
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Breakdown Voltage
-20 V
Continuous Drain Current (ID)
25 mA
Current Rating
25 mA
Drain to Source Voltage (Vdss)
20 V
Element Configuration
Single
Gate to Source Voltage (Vgs)
-20 V
Max Junction Temperature (Tj)
150 °C
Max Operating Temperature
150 °C
Max Power Dissipation
300 mW
Min Breakdown Voltage
20 V
Min Operating Temperature
-65 °C
Number of Elements
1
Packaging
Cut Tape
Power Dissipation
300 mW
Termination
SMD/SMT
Voltage Rating
20 V