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EPCOS B82422A3331K100

Ind Chip Molded Wirewound 330nH 10% 1MHz 22Q-Factor Ceramic 200mA 1210 Blister T/R

Product Details

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Compliance

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Lead Free
Lead Free
Radiation Hardening
No
Ratings
AEC-Q200
RoHS
Compliant

Dimensions

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Depth
2.8 mm
Height
2 mm
Height - Seated (Max)
2.1082 mm
Length
3.2 mm
Max Length
3.5 mm
Max Width
2.8 mm
Width
2.5 mm

Physical

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Case Code (Imperial)
1210
Case Code (Metric)
3225
Case/Package
1210
Core Material
Ceramic, Ferrite
Mount
Surface Mount
Number of Pins
2
Weight
50.008559 mg

Supply Chain

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Lifecycle Status
Production

Technical

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Composition
Wirewound
Current Rating
200 mA
DC Current
200 mA
DC Resistance (DCR)
1.3 Ω
Inductance
330 nH
Inductance Tolerance
10 %
Max DC Current
200 mA
Max Operating Temperature
125 °C
Military Standard
Not
Min Operating Temperature
-55 °C
Packaging
Cut Tape (CT)
Q Factor
22
Resistance
1.3 Ω
Self Resonant Frequency
580 MHz
Shielding
Unshielded
Termination
SMD/SMT
Test Frequency
1 MHz
Tolerance
10 %

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