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CTS Components BDN09-3CB/A01

Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 26.9C/W Black Anodized

Product Details

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Compliance

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Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant

Dimensions

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Depth
23.114 mm
Height
9.02 mm
Height Off Base
9.017 mm
Length
23.114 mm
Thickness
2.29 mm
Width
IBS

Physical

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Color
Black
Material
Aluminium, Anodized
Mount
Adhesive
Package Cooled
26.9 °C/W
Shape
Fins, Square

Technical

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Natural Thermal Resistance
26.9 °C/W
Thermal Resistance @ Forced Air Flow (100 LFM)
9.6 °C/W
Type
Passive

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